DFLS120L
Document number: DS30444 Rev. 6 - 2
1 of 4
www.diodes.com
June 2011
© Diodes Incorporated
DFLS120L
PowerDI is a registered trademark of Diodes Incorporated.
1.0A SURFACE MOUNT SCHOTTKY BARRIER RECTIFIER
PowerDI
®
123
Features
• Guard Ring Die Construction for Transient Protection
• Low Power Loss, High Efficiency
• Patented Interlocking Clip Design for High Surge Current
Capacity
• High Current Capability and Low Forward Voltage Drop
• Lead Free Finish, RoHS Compliant (Note 4)
• "Green" Molding Compound (No Br, Sb)
• Qualified to AEC-Q101 Standards for High Reliability
Mechanical Data
• Case: PowerDI
®
123
• Case Material: Molded Plastic, “Green” Molding Compound.
UL Flammability Classification Rating 94V-0
• Moisture Sensitivity: Level 1 per J-STD-020D
• Terminal Connections: Cathode Band
• Terminals: Finish – Matte Tin annealed over Copper
leadframe. Solderable per MIL-STD-202, Method 208
• Marking Information: See Page 2
• Ordering Information: See Page 2
• Weight: 0.01 grams (approximate)
Maximum Ratings @T
A
= 25°C unless otherwise specified
Single phase, half wave, 60Hz, resistive or inductive load.
For capacitance load, derate current by 20%.
Characteristic Symbol Value Unit
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
V
RRM
V
RWM
V
R
20 V
RMS Reverse Voltage
V
R
RMS
14 V
Average Forward Current
I
F
AV
1.0 A
Non-Repetitive Peak Forward Surge Current 8.3ms
single half sine-wave superimposed on rated load
I
FSM
50 A
Thermal Characteristics
Characteristic Symbol Value Unit
Power Dissipation (Note 1)
P
D
1.67 W
Power Dissipation (Note 2)
P
D
556 mW
Thermal Resistance Junction to Ambient (Note 1)
R
JA
60 °C/W
Thermal Resistance Junction to Ambient (Note 2)
R
JA
180
°C/W
Thermal Resistance Junction to Soldering (Note 3)
R
JS
10 °C/W
Operating Temperature Range
T
J
-55 to +125
°C
Storage Temperature Range
T
STG
-55 to +150 °C
Electrical Characteristics @T
A
= 25°C unless otherwise specified
Characteristic Symbol Min Typ Max Unit Test Condition
Reverse Breakdown Voltage (Note 5)
V
BR
R
20
⎯ ⎯
V
I
R
= 1.0mA
Forward Voltage
V
F
⎯
⎯
⎯
0.20
0.30
0.32
⎯
⎯
0.36
V
I
F
= 0.1A
I
F
= 0.7A
I
F
= 1.0A
Leakage Current (Note 5)
I
R
⎯
⎯
0.26
⎯
⎯
1.0
mA
V
R
= 5V, T
A
= 25°C
V
R
= 20V, T
A
= 25°C
Total Capacitance
C
T
⎯
75
⎯
pF
V
R
= 10V, f = 1.0MHz
Notes: 1. Part mounted on 50.8mm X 50.8mm GETEK board with 25.4mm X 25.4mm copper pad, 25% anode, 75% cathode. T
A
= 25°C.
2. Part mounted on FR-4 board with 1.8mm X 2.5mm cathode and 1.8mm X 1.2mm anode, 1 oz. copper pads. T
A
= 25°C.
3. Theoretical R
θJS
calculated from the top center of the die straight down to the PCB/cathode tab solder junction.
4. EU Directive 2002/95/EC (RoHS). All applicable RoHS exemptions applied, see EU Directive 2002/95/EC Annex Notes.
5. Short duration pulse test used to minimize self-heating effect.
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