Diodes SBR2M30P1 User Manual download pdf

SBR2M30P1

2.0A SBR

SURFACE MOUNT SUPER BARRIER RECTIFIER

PowerDI

123

Features

• Ultra Low Leakage Current

• Excellent High Temperature Stability

• Superior Reverse Avalanche Capability

• Patented Interlocking Clip Design for High Surge Current

Capacity

• Patented Super Barrier Rectifier Technology

• Soft, Fast Switching Capability

• 175ºC Operating Junction Temperature

• ±16KV ESD Protection (HBM, 3B)

• ±25KV ESD Protection (IEC61000-4-2 Level 4, Air Discharge)

• Lead Free Finish, RoHS Compliant (Note 1)

• “Green” Molding Compound (No Br, Sb)

• Qualified to AEC-Q 101 Standards for High Reliability

Mechanical Data

• Case: PowerDI

123

• Case Material: Molded Plastic, “Green” Molding Compound.

UL Flammability Classification Rating 94V-0

• Moisture Sensitivity: Level 1 per J-STD-020D

• Polarity Indicator: Cathode Band

• Terminals: Matte Tin Finish annealed over Copper leadframe.

Solderable per MIL-STD-202, Method 208

• Marking Information: See Page 4

• Ordering Information: See Page 4

• Weight: 0.018 grams (approximate)

Top View

Maximum Ratings @T

= 25°C unless otherwise specified

Single phase, half wave, 60Hz, resistive or inductive load.

For capacitance load, derate current by 20%.

Characteristic Symbol Value Unit

Peak Repetitive Reverse Voltage

Working Peak Reverse Voltage

DC Blocking Voltage

RRM

RWM

30 V

RMS Reverse Voltage

R(RMS)

21 V

Average Rectified Output Current (See Figure 1)

2.0 A

Non-Repetitive Peak Forward Surge Current 8.3ms

Single Half Sine-Wave Superimposed on Rated Load

FSM

75 A

Non-Repetitive Avalanche Energy

= 25°C, I

= 5A, L = 8.5 mH)

105 mJ

Repetitive Peak Avalanche Energy

(1µs, 25°C)

ARM

1100 W

Thermal Characteristics

Characteristic Symbol Value Unit

Maximum Thermal Resistance

Thermal Resistance Junction to Soldering (Note 2)

Thermal Resistance Junction to Ambient (Note 3)

Thermal Resistance Junction to Ambient (Note 4)

183

125

ºC/W

Operating and Storage Temperature Range

, T

STG

-65 to +175 ºC

Notes: 1. RoHS revision 13.2.2003. High temperature solder exemption applied, see EU Directive Annex Note 7.

2. Theoretical R

ӨJS

calculated from the top center of the die straight down to the PCB cathode tab solder junction.

3. FR-4 PCB, 2 oz. Copper, minimum recommended pad layout per http://www.diodes.com/datasheets/ap02001.pdf.

4. Polymide PCB, 2 oz. Copper, minimum recommended pad layout per http://www.diodes.com/datasheets/ap02001.pdf

SBR and PowerDI are registered trademarks of Diodes Incorporated.

SBR2M30P1

Document number: DS30704 Rev. 7 - 2

1 of 4

www.diodes.com

October 2008

1 2 3 4

SBR2M30P1 2

Summary of Contents

Page 1

SBR2M30P1 2.0A SBR® SURFACE MOUNT SUPER BARRIER RECTIFIER PowerDI®123 Features • Ultra Low Leakage Current • Excellent High Temperature Stability

Page 2 - SBR2M30P1

SBR2M30P1 Document number: DS30704 Rev. 7 - 2 2 of 4 www.diodes.com October 2008© Diodes Incorporated SBR2M30P1BR and PowerDI are registered tradem

Page 3

SBR2M30P1 Document number: DS30704 Rev. 7 - 2 3 of 4 www.diodes.com October 2008© Diodes Incorporated SBR2M30P1BR and PowerDI are registered tradem

SBR2M30P1 Document number: DS30704 Rev. 7 - 2 4 of 4 www.diodes.com October 2008© Diodes Incorporated SBR2M30P1SBR and PowerDI are registered trade

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