Diodes MMBD3004BRM User Manual

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MMBD3004BRM
Document number: DS30387 Rev. 8 - 2
1 of 3
www.diodes.com
March 2008
© Diodes Incorporated
MMBD3004BRM
HIGH VOLTAGE SURFACE MOUNT SWITCHING DIODE ARRAY
Features
Two Series Diode Circuits Connect to Form Full Wave Bridge
Fast Switching Speed
High Conductance
High Reverse Breakdown Voltage Rating
Lead Free/RoHS Compliant Version (Note 3)
"Green" Device (Notes 4 and 5)
Mechanical Data
Case: SOT-26
Case Material: Molded Plastic, "Green" Molding Compound,
Note 5. UL Flammability Classification Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020D
Terminals: Solderable per MIL-STD-202, Method 208
Lead Free Plating (Matte Tin Finish annealed over Copper
leadframe).
Polarity: See Diagram
Marking Information: See Page 2
Ordering Information: See Page 2
Weight: 0.016 grams (approximate)
SOT-26
AC
1
C
1
C
2
AC
2
A
1
A
2
Internal Schematic
TOP VIEW
TOP VIEW
Maximum Ratings @T
A
= 25°C unless otherwise specified
Characteristic Symbol Value Unit
Repetitive Peak Reverse Voltage
V
RRM
350 V
Working Peak Reverse Voltage
DC Blocking Voltage
V
RWM
V
R
300 V
RMS Reverse Voltage
V
R(RMS)
212 V
Forward Continuous Current (Note 1)
I
F
225 mA
Peak Repetitive Forward Current (Note 1)
I
FRM
625 mA
Non-Repetitive Peak Forward Surge Current @ t = 1.0μs
@ t = 1.0s
I
FSM
4.0
1.0
A
Thermal Characteristics
Characteristic Symbol Value Unit
Power Dissipation (Note 1)
P
D
350 mW
Thermal Resistance Junction to Ambient Air (Note 1)
R
θ
JA
357
°C/W
Operating and Storage Temperature Range
T
J
, T
STG
-65 to +150
°C
Electrical Characteristics @T
A
= 25°C unless otherwise specified
Characteristic Symbol Min Typ Max Unit Test Condition
Reverse Breakdown Voltage (Note 2)
V
(BR)R
350
V
I
R
= 150μA
Forward Voltage
V
F
0.78
0.93
1.03
0.87
1.0
1.25
V
I
F
= 20mA
I
F
= 100mA
I
F
= 200mA
Reverse Current (Note 2)
I
R
30
35
100
100
nA
μA
V
R
= 240V
V
R
= 240V, T
J
= 150°C
Total Capacitance
C
T
1.0 5.0 pF
V
R
= 0V, f = 1.0MHz
Reverse Recovery Time
t
rr
50 ns
I
F
= I
R
= 30mA,
I
rr
= 3.0mA, R
L
= 100Ω
Notes: 1. Part mounted on FR-4 board with recommended pad layout, which can be found on our website at http://www.diodes.com/datasheets/ap02001.pdf.
2. Short duration pulse test used to minimize self-heating effect.
3. No purposefully added lead.
4. Diodes Inc.'s "Green" policy can be found on our website at http://www.diodes.com/products/lead_free/index.php.
5. Product manufactured with Date Code 0627 (week 27, 2006) and newer are built with Green Molding Compound. Product
manufactured prior to Date Code 0627 are built with Non-Green Molding Compound and may contain Halogens or Sb2O3 Fire Retardants.
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Summary of Contents

Page 1 - MMBD3004BRM

MMBD3004BRM Document number: DS30387 Rev. 8 - 2 1 of 3 www.diodes.com March 2008© Diodes Incorporated MMBD3004BRM HIGH VOLTAGE SURFACE MOUNT SWITCH

Page 2 - Marking Information

MMBD3004BRM 400T , AMBIENT TEMPERATURE, (°C)Fig. 1 Power Derating Curve, Total PackageAP, POWER DISSIPATION (mW)D200100300050002.00.40.81.21.6Note

Page 3 - © Diodes Incorporated

MMBD3004BRM Package Outline Dimensions MMBD3004BRM Document number: DS30387 Rev. 8 - 2 3 of 3 www.diodes.com March 2008© Diodes Incorporated

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