MMBD3004BRM
Document number: DS30387 Rev. 8 - 2
1 of 3
www.diodes.com
March 2008
© Diodes Incorporated
MMBD3004BRM
HIGH VOLTAGE SURFACE MOUNT SWITCHING DIODE ARRAY
Features
• Two Series Diode Circuits Connect to Form Full Wave Bridge
• Fast Switching Speed
• High Conductance
• High Reverse Breakdown Voltage Rating
• Lead Free/RoHS Compliant Version (Note 3)
• "Green" Device (Notes 4 and 5)
Mechanical Data
• Case: SOT-26
• Case Material: Molded Plastic, "Green" Molding Compound,
Note 5. UL Flammability Classification Rating 94V-0
• Moisture Sensitivity: Level 1 per J-STD-020D
• Terminals: Solderable per MIL-STD-202, Method 208
• Lead Free Plating (Matte Tin Finish annealed over Copper
leadframe).
• Polarity: See Diagram
• Marking Information: See Page 2
• Ordering Information: See Page 2
• Weight: 0.016 grams (approximate)
SOT-26
AC
1
C
1
C
2
AC
2
A
1
A
2
Internal Schematic
TOP VIEW
TOP VIEW
Maximum Ratings @T
A
= 25°C unless otherwise specified
Characteristic Symbol Value Unit
Repetitive Peak Reverse Voltage
V
RRM
350 V
Working Peak Reverse Voltage
DC Blocking Voltage
V
RWM
V
R
300 V
RMS Reverse Voltage
V
R(RMS)
212 V
Forward Continuous Current (Note 1)
I
F
225 mA
Peak Repetitive Forward Current (Note 1)
I
FRM
625 mA
Non-Repetitive Peak Forward Surge Current @ t = 1.0μs
@ t = 1.0s
I
FSM
4.0
1.0
A
Thermal Characteristics
Characteristic Symbol Value Unit
Power Dissipation (Note 1)
P
D
350 mW
Thermal Resistance Junction to Ambient Air (Note 1)
R
θ
JA
357
°C/W
Operating and Storage Temperature Range
T
J
, T
STG
-65 to +150
°C
Electrical Characteristics @T
A
= 25°C unless otherwise specified
Characteristic Symbol Min Typ Max Unit Test Condition
Reverse Breakdown Voltage (Note 2)
V
(BR)R
350
⎯ ⎯
V
I
R
= 150μA
Forward Voltage
V
F
⎯
0.78
0.93
1.03
0.87
1.0
1.25
V
I
F
= 20mA
I
F
= 100mA
I
F
= 200mA
Reverse Current (Note 2)
I
R
⎯
30
35
100
100
nA
μA
V
R
= 240V
V
R
= 240V, T
J
= 150°C
Total Capacitance
C
T
⎯
1.0 5.0 pF
V
R
= 0V, f = 1.0MHz
Reverse Recovery Time
t
rr
⎯ ⎯
50 ns
I
F
= I
R
= 30mA,
I
rr
= 3.0mA, R
L
= 100Ω
Notes: 1. Part mounted on FR-4 board with recommended pad layout, which can be found on our website at http://www.diodes.com/datasheets/ap02001.pdf.
2. Short duration pulse test used to minimize self-heating effect.
3. No purposefully added lead.
4. Diodes Inc.'s "Green" policy can be found on our website at http://www.diodes.com/products/lead_free/index.php.
5. Product manufactured with Date Code 0627 (week 27, 2006) and newer are built with Green Molding Compound. Product
manufactured prior to Date Code 0627 are built with Non-Green Molding Compound and may contain Halogens or Sb2O3 Fire Retardants.
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