DMP58D0SV
Document number: DS31293 Rev. 4 - 2
1 of 5
www.diodes.com
July 2009
© Diodes Incorporated
DMP58D0SV
DUAL P-CHANNEL ENHANCEMENT MODE FIELD EFFECT TRANSISTOR
Features
• Low On-Resistance
• ESD Protected Gate to 500V
• Low Input Capacitance
• Fast Switching Speed
• Lead Free By Design/RoHS Compliant (Note 3)
• “Green” Device (Note 4)
• Qualified to AEC-Q 101 Standards for High Reliability
Mechanical Data
• Case: SOT-563
• Case Material: Molded Plastic, "Green" Molding Compound.
UL Flammability Classification Rating 94V-0
• Moisture Sensitivity: Level 1 per J-STD-020D
• Terminals: Finish ⎯ Matte Tin annealed over Copper leadframe.
Solderable per MIL-STD-202, Method 208
• Terminal Connections: See Diagram
• Marking Information: See Page 3
• Ordering Information: See Page 3
• Weight: 0.006 grams (approximate)
Maximum Ratings @T
A
= 25°C unless otherwise specified
Characteristic Symbol Value Units
Drain-Source Voltage
V
DSS
-50 V
Drain-Gate Voltage (Note 1)
V
DGR
-50 V
Gate-Source Voltage Continuous
V
GSS
20
V
Drain Current (Note 2) Continuous
I
D
-160 mA
Thermal Characteristics @T
A
= 25°C unless otherwise specified
Characteristic Symbol Value Units
Total Power Dissipation (Note 2)
P
D
400 mW
Thermal Resistance, Junction to Ambient (Note 2)
R
JA
313
°C/W
Operating and Storage Temperature Range
T
J
, T
STG
-55 to +150
°C
Electrical Characteristics @T
A
= 25°C unless otherwise specified
Characteristic Symbol Min Typ Max Unit Test Condition
OFF CHARACTERISTICS (Note 5)
Drain-Source Breakdown Voltage
BV
DSS
-50
⎯ ⎯
V
V
GS
= 0V, I
D
= -250μA
Zero Gate Voltage Drain Current
I
DSS
⎯ ⎯
-1
μA
V
DS
= -50V, V
GS
= 0V
Gate-Body Leakage
I
GSS
⎯ ⎯
±5 μA
V
GS
= ±20V, V
DS
= 0V
ON CHARACTERISTICS (Note 5)
Gate Threshold Voltage
V
GS
th
-0.8
⎯
-2.1 V
V
DS
= V
GS
, I
D
= -250μA
Static Drain-Source On-Resistance
R
DS
ON
⎯
6 8
Ω V
GS
= -5V, I
D
= -0.100A
Forward Transconductance
g
FS
0.05
⎯ ⎯
S
V
DS
= -25V, I
D
= -0.1A
DYNAMIC CHARACTERISTICS
Input Capacitance
C
iss
⎯
27
⎯
pF
V
DS
= -25V, V
GS
= 0V, f = 1.0MHz
Output Capacitance
C
oss
⎯
4
⎯
pF
Reverse Transfer Capacitance
C
rss
⎯
1.4
⎯
pF
Notes: 1. R
GS
≤ 20KΩ.
2. Device mounted on FR-4 PCB, 1 inch x 0.85 inch x 0.062 inch; pad layout as shown on Diodes Inc. suggested pad layout document AP02001, which
can be found on our website at http://www.diodes.com/datasheets/ap02001.pdf.
3. No purposefully added lead.
4. Diodes Inc’s “Green” policy can be found on our website at http://www.diodes.com/products/lead_free/index.php.
5. Short duration pulse test used to minimize self-heating effect.
SOT-563
TOP VIEW
Internal Schematic
TOP VIEW
S
1
D
1
D
2
S
2
G
1
G
2
ESD protected to 500V
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