Diodes DFLS130L User Manual

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DFLS130L
Document number: DS30492 Rev. 4 - 2
1 of 4
www.diodes.com
June 2009
© Diodes Incorporated
DFLS130L
PowerDI is a registered trademark of Diodes Incorporated.
1.0A SURFACE MOUNT SCHOTTKY BARRIER RECTIFIER
PowerDI
®
123
Features
Guard Ring Die Construction for Transient Protection
Low Power Loss, High Efficiency
Patented Interlocking Clip Design for High Surge Current
Capacity
High Current Capability and Low Forward Voltage Drop
Lead Free Finish, RoHS Compliant (Note 4)
"Green" Molding Compound (No Br, Sb)
Qualified to AEC-Q101 Standards for High Reliability
Mechanical Data
Case: PowerDI
®
123
Case Material: Molded Plastic, “Green” Molding Compound.
UL Flammability Classification Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020D
Terminal Connections: Cathode Band
Terminals: Finish – Matte Tin annealed over Copper
leadframe. Solderable per MIL-STD-202, Method 208
Marking Information: See Page 2
Ordering Information: See Page 2
Weight: 0.01 grams (approximate)
Maximum Ratings @T
A
= 25°C unless otherwise specified
Single phase, half wave, 60Hz, resistive or inductive load.
For capacitance load, derate current by 20%.
Characteristic Symbol Value Unit
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
V
RRM
V
RWM
V
R
30 V
RMS Reverse Voltage
V
R
(
RMS
)
21 V
Average Forward Current @ T
T
= 121°C I
F
(
AV
)
1.0 A
Non-Repetitive Peak Forward Surge Current 8.3ms
Single Half Sine-Wave Superimposed on Rated Load
I
FSM
50 A
Thermal Characteristics
Characteristic Symbol Value Unit
Power Dissipation (Note 1)
P
D
1.67 W
Power Dissipation (Note 2)
P
D
556 mW
Thermal Resistance Junction to Ambient (Note 1)
R
θ
JA
60 °C/W
Thermal Resistance Junction to Ambient (Note 2)
R
θ
JA
180 °C/W
Thermal Resistance Junction to Soldering (Note 3)
R
θ
JS
10 °C/W
Operating Temperature Range
T
J
-40 to +125 °C
Storage Temperature Range
T
STG
-40 to +150 °C
Electrical Characteristics @T
A
= 25°C unless otherwise specified
Characteristic Symbol Min Typ Max Unit Test Condition
Reverse Breakdown Voltage (Note 5)
V
(
BR
)
R
30
V
I
R
= 1.0mA
Forward Voltage
V
F
0.210
0.310
0.328
0.36
V
I
F
= 0.1A
I
F
= 1.0A
I
F
= 1.5A
Leakage Current (Note 5)
I
R
0.260
1.0
mA
V
R
= 5V, T
A
= 25°C
V
R
= 30V, T
A
= 25°C
Total Capacitance
C
T
76
pF
V
R
= 10V, f = 1.0MHz
Notes: 1. Part mounted on 2"x2" GETEK board with 1"x1" copper pad, 25% anode, 75% cathode. T
A
= 25°C.
2. Part mounted on FR-4 board with recommended pad layout, which can be found on our website at http://www.diodes.com/datasheets/ap02001.pdf.
3. Theoretical R
θJS
calculated from the top center of the die straight down to the PCB/cathode tab solder junction.
4. EU Directive 2002/95/EC (RoHS). All applicable RoHS exemptions applied. Please visit our website at http://www.diodes.com/products/lead_free.html.
5. Short duration pulse test used to minimize self-heating effect.
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Summary of Contents

Page 1

DFLS130L Document number: DS30492 Rev. 4 - 2 1 of 4 www.diodes.com June 2009© Diodes Incorporated DFLS130LPowerDI is a registered trademark of Diod

Page 2 - Marking Information

DFLS130L Document number: DS30492 Rev. 4 - 2 2 of 4 www.diodes.com June 2009© Diodes Incorporated DFLS130LPowerDI is a registered trademark of Diod

Page 3 - © Diodes Incorporated

DFLS130L Document number: DS30492 Rev. 4 - 2 3 of 4 www.diodes.com June 2009© Diodes Incorporated DFLS130LPowerDI is a registered trademark of Diod

Page 4

DFLS130L Document number: DS30492 Rev. 4 - 2 4 of 4 www.diodes.com June 2009© Diodes Incorporated DFLS130LPowerDI is a registered trademark of Diod

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